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Camera module bonding

Solution

SY2101

Performance characteristicsLow temperature curing/excellent water blocking performance/good adhesion
Viscosity (cPs@25℃)4,000
Curing method60 minutes/70℃
Elongation at break(%)2.0
Glass transition temperature (℃)75.0

SY2152

Performance characteristicsLow modulus/good fluidity at room temperature/fast curing speed
Viscosity (cPs@25℃)2,300
Curing method30 minutes/80℃
Elongation at break(%)34.2
Glass transition temperature (℃)17.7

SY2301

Performance characteristicsLow temperature curing/good flexibility/low shrinkage/high bonding strength
Viscosity (cPs@25℃)40,000
Curing method10 minutes/80℃
Elongation at break(%)17.1
Glass transition temperature (℃)42.1