High end electronic semiconductor packaging-Youxing Shark (Shanghai) Technology Co., Ltd

Semiconductor Underfill

Solution

Through the design and synthesis of self-developed special ultra-high-purity modified epoxy resin, combined with the preparation, modification and compounding of electronic-grade spherical fillers, and capillary underfill (CUF), the chip structure strength and reliability are improved.

Ultra-low viscosity (500-6000 mPa·s)
High glass transition temperature (Tg≧130℃)
Extremely low coefficient of thermal expansion (CTE) alpha1<30ppm/°C
High fracture toughness, low warpage, reworkable

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Display Optical Bonding

Solution

By bonding transparent optical components, the panel and touchscreen are fully laminated, effectively reducing light reflection and transmission losses, while preventing dust, debris, and moisture ingress, thereby improving visual performance. It has significant advantages in large-size, curved, and irregular product applications.

UV rapid curing (1000 mW/cm² @ 1-3 seconds)
Extremely low curing shrinkage (< 0.5%), reducing the probability of mura and enabling thinner adhesive layers
Superior weather resistance, with long-term optical stability under high temperature, ultra-low temperature, and UV exposure (L* ≥ 98%, b* < 0.5, Haze(%) < 0.5)
Excellent dimensional stability, with volume resistivity, adhesion, and elastic modulus minimally affected by temperature (-40°C to 150°C)

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Camera Module Adhesive

Solution

Optical Lens Light-Shielding Material:

Photochromic technology = transparent to black,with post-curing OD value controllable between 0.1-3, and irreversible fading.

Low-Temperature Curing Adhesive:

Rapid curing at low temperature (≤ 80°C), high humidity and heat resistance, ultra-low RBO (outgassing distance 0.1 mm).

Active Alignment Dual Cure Adhesive:

UV rapid positioning + low temperature curing, exellent adhesion to low surface energy materials such as LCP/PBT, high reliability.

Excellent application performance, aspect ratio > 0.6
Superior blackness and low light transmittance, meeting special optical requirements
LED rapid curing (UV CURE 1000 mW/cm² @ 15-35 seconds)
High adhesion and reliability (SFR variation 30)

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High end electronic semiconductor solution

Youxing Shark provides advanced electronic and semiconductor chip packaging solutions, offering alternatives to imported materials.

Semiconductor Underfill

Solution

Display Optical Bonding

Solution

Camera Module Adhesive

Solution