Through the design and synthesis of self-developed special ultra-high-purity modified epoxy resin, combined with the preparation, modification and compounding of electronic-grade spherical fillers, and capillary underfill (CUF), the chip structure strength and reliability are improved.

Through the design and synthesis of self-developed special ultra-high-purity modified epoxy resin, combined with the preparation, modification and compounding of electronic-grade spherical fillers, and capillary underfill (CUF), the chip structure strength and reliability are improved.

Optical lens shading material:
Photochromic technology = transparent to black, the OD value after curing can be controlled at 01-3, and irreversible fading
Low temperature curing glue:
Rapid curing at low temperature (≤80°C), high resistance to moisture and heat, ultra-low RBO (separation distance 0.1mm)
Active Alignment Dual Cure Adhesive:
UV rapid positioning + low temperature curing, good adhesion to low surface energy materials such as LCP/PBT, high reliability