Chinese | English Create new materials, coalesce all things in symbiosis.

Semiconductor underfill

Solution

SY6101D

Performance characteristicsGood fluidity at room temperature/fast curing speed/excellent reliability/reworkable
Viscosity (cPs@25℃)300~500
Curing method8 minutes/130℃
Elongation at break(%)2.60
Glass transition temperature (C)106

SY6201D

Performance characteristicsFirst-level packaging underfill/fast curing/reworkable/excellent heat and cold cycle resistance
Viscosity (cPs@25℃)4,000-7.000
Curing method10 minutes/150℃
Elongation at break(%)130
Glass transition temperature (℃)25

SY6202D

Performance characteristicsLevel 2 packaging underfill/room temperature fast flow/no bubbles/repairable/excellent reliability
Viscosity(cPs@25C)300~600
Curing method10 minutes/130℃
Elongation at break(%)108
Glass transition temperature (℃)60