technical background

　　Underfill, also called underfill, has the functions of reducing the stress impact caused by the difference in thermal expansion coefficient between the chip and the substrate, improving the reliability of the component structural strength, and enhancing the drop resistance between the chip and PCBA. It is mainly used in the PCB board-level packaging process of terminal products such as mobile phones, computers, and tablets. It is a key packaging material to improve the reliability of electronic products. The underfill rubber market basically relies on imports, and there is currently a large gap in the country.

　　Performance requirements

　　Low viscosity, good fluidity, high filling efficiency

　　Low CTE, high Tg, low modulus, high reliability

　　Reworkable and easy to clean

　　Underfill technology process:

　　Use capillary action to quickly flow the adhesive through the bottom of the BGA chip Bottom of the chip

　　Dispensing method: "1" type or "L" type

　　Focus on performance: liquidity

　　The performance of underfill glue products directly affects the yield of integrated circuit board-level chip packaging, so the early operations must be filled in place perfectly. To ensure rapid and complete filling, the adhesive must have low viscosity and fast flow, which is also the first consideration when choosing a bottom adhesive.

　　Youxingsha—Board-level underfill glue SHARK 1162 for the electronics industry

　　Working on "core" technology, efficient and stable

　　SHARK 1162 is a board-level underfill adhesive for the electronics industry launched by Youxingshark. It is a one-component heat-cured epoxy adhesive. It is a low-halogen environmentally friendly product. It has good fluidity at room temperature and can be cured at medium temperatures. It has Excellent electrical properties, excellent performance in actual industrial applications.

　　Features

　　Low viscosity, good flow properties, low CTE, high Tg, low modulus

　　Technical Parameters

　　Characteristics before curing

　　Typical Cure Properties

　　Recommended curing conditions: 10 min @ 130°C (can be adjusted appropriately according to customer curing equipment and oven temperature)

　　Curing thermal weight loss: < 1%

　　Cured properties

　　Product performance evaluation (1): Liquid rheological properties

　　01 TA rotational rheometer experiment

　　Experimental results

　　The rheological curves of SHARK-1162 and the control product 3808 (foreign brand) basically overlap, and the viscosities are both ≤500mPa·s.

　　02 Actual measurement of dispensing application

　　Compare the fluidity through the time it takes for the two adhesives to flow through the gauge lengths of 10mm and 15mm.

　　Experimental results

　　After standing for 5 minutes, the flow patterns of the two adhesives were similar.

　　Summarize

　　The viscosity and fluidity of SHARK-1162 are comparable to foreign products, showing excellent fluidity and filling effects.