Professional bonding solutions for new energy battery systems, featuring modified polyurethane and MS polymer technologies. Delivers excellent mechanical properties and durability with automated application, meeting stringent requirements for structural strength, thermal conduction, and sealing in power batteries. Custom solutions available.

To address high heat flux challenges in electronics, our silicon/non-silicon composite materials with multi-scale filler technology achieve ultra-low thermal resistance at chip-heatsink and substrate-housing interfaces. These materials maintain stable thermal conductivity and interfacial adaptability from -50°C to 200°C, meeting extreme cooling demands in 5G, AI processors, and electric vehicles.